The models of the XDV® series are the most powerful X-ray fluorescence instruments in the Fischer portfolio. They are equipped with a highly sensitive silicon drift detector (SDD) and can further be fitted with different apertures and filters. Additionally, XDV-µ instruments come with a micro-focus tube. This makes them ideal for very demanding measurement tasks. Using XDV devices you can, for instance, analyze the thickness and elemental composition of coatings just 5 nm thick and test structures of just 10 µm.
Precise measurement of the thinnest coatings with repeatable accuracy, thanks to high-performance X-ray tubes and sensitive silicon drift detectors (SDD)
Extremely robust construction for long-lasting serial testing, with outstanding long-term stability
The XDV-µ LD option with a long measuring distance (min. 12 mm)
An additional helium purge with the XDV-µ LEAD FRAME option provides for a very wide range of elements – from sodium (11) to uranium (92)
Advanced polycapillary X-ray optics to focus the X-rays on an extremely small measurement surface
Automated serial testing with programmable XY-table and Z-axis (optional)
Fast and simple positioning of the probes with the help of video imaging and laser pointer
Coating Thickness Measurement
Anti-wear coatings such as NiP layers on the tiniest of watch components
Very thin precious-metal coatings on visible components in mechanical watch movements
Measuring on assembled circuit boards
Testing base metallization layers (Under Bump Metallization, UBM) in the nanometer range
Measurement of C4 and smaller solder bumps
Detection of undesirable substances (for example heavy metals) in electronics, packaging and consumer goods according to RoHS, WEEE, CPSIA and other guidelines
Analysis of very light elements like sodium
Composition of functional coatings, such as the determination of phosphorous content in NiP
Analysis of gold and other precious metals, as well as alloys thereof
Analysis of lead-free solder caps on copper pillars
Testing the elemental composition of C4 and smaller solder bumps, base metallization layers (UBM) and small contact surfaces in the semiconductor industry
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