FISCHERSCOPE X-RAY XDV-µ SEMI
XRF for inspecting wafer microstructures
The FISCHERSCOPE X-RAY XDV-μ SEMI is an automated measurement system optimized for the quality control of micro-structures in complex 2.5D/3D packaging applications in the semiconductor industry. Fully automated analysis prevents damage to valuable wafer material. And consistent test conditions deliver reliable results. The instrument is suitable for use in clean rooms, and a comprehensive equipment catalog allows simple integration into existing wafer fabs.