QATM Consumables Mounting

• QPREP EPO BLACK is a fine granular, epoxy resin based thermosetting hot mounting material. As a hot mounting medium that does not require labelling, it makes a significant contribution to improving safety in the laboratory.
• QPREP EPO MAX is an epoxy resin compound for hot mounting with high edge retention. It is optimized for low adhesion on mould and ram surfaces. EPO-MAX is currently our fastest hot mounting material!

• QPREP DUROPLAST BLACK is an electrically conductive hot mounting material. It is suitable for SEM examinations and electrolytic polishing.

• QPREP THERMOPLAST is a highly transparent hot mounting material consisting of acrylic resin.
• THERMOPLAST BIO is a dust-free and non-hazardous hot mounting compound based on PLA and wood flour. It is best suited for routine metallographic sample preparation. The uniform granulation allows clean and dust-free filling, thereby supporting a safe working environment in the laboratory.
• THERMOPLAST FILL is a polypropylene‑based hot mounting compound, ideal for use as a filling material. It represents a cost‑efficient and safe alternative to conventional phenolic resins.The uniform granulation allows clean and dust‑free filling, thereby supporting a safe working environment in the laboratory.

QPREP BAKELIT is an all-purpose hot mounting material. It is suitable for general materialographic applications.

• Very convenient for filling in combination with other hot mounting material
• Contains wood flour and graphite
• Hardness (Shore D): 90
• Removal rate: medium

QPREP BAKELIT BLACK

• Contains wood flour and graphite

QPREP BAKELIT GREEN

• Suitable for color coding
• Contains wood flour

QPREP BAKELIT RED

• Suitable for color coding
• Contains wood flour

Depending on the shape of the specimen to be mounted, the chosen hot mounting material, and the objectives of the materialographic preparation QPREP’s wide range of accessories and tools ensures the best possible analysis results.

• Anti-stick silicone paste and spray to protect the mould and ram surfaces
• Various clamps for aligning specimens with complex geometries
• Funnel for clean and loss-free filling of the mounting resin into the press mould.

• QPREP KEM 15 PLUS is a universally applicable two-component cold mounting material based on a modified polyester resin. Due to its very low shrinkage, it is particularly suitable for boundary layer investigations.
• QPREP KEM 20 is a universally applicable two-component cold mounting material based on a methyl methacrylate resin compound. Transparent mountings can be realized when curing under overpressure.
• QPREP KEM 30 is a universal two-component cold mounting resin based on a methyl methacrylate resin compound. It is a fast curing resin, which is particularly suitable for high sample throughput.
• QPREP KEM 35 is a universally applicable two-component cold mounting material based on a methyl methacrylate resin compound. Due to its very low shrinkage and hardness, it is particularly suitable for edge examination on materials with higher hardness.
• QPREP KEM 60 is a universally applicable, mineral-filled, MMA-free two-component cold mounting resin. It is characterized by short curing time and good mechanical machinability.

• QPREP SEM 5000 is an electrically conductive cold mounting material based on a modified Methyl methacrylate compound. It is suitable for SEM examinations and electrolytic polishing.

• QPREP QPOX 90 is a transparent two-component cold mounting material based on an epoxy resin. Due to its good flowability, it is well suited for the pre-potting of specimens with filigree and complex geometries.
• QPREP QPOX 92 is a highly transparent two-component cold mounting material on epoxy resin. It is very well suited for specimens with filigree and complex geometries. In addition, QPOX 92 is particularly recommended for mounting materials with temperature sensitive surfaces and for target preparations.
• QPOX 93 is a low-viscosity and crystal-clear two-component cold mounting agent based on epoxy resin. Qpox 93 enables absolutely transparent and gap-free mounting and, with a curing time of around 8-12 hours, is also ideal for the preparation of routine samples. Free of solvents, DETA and CMR substances, it enables safer handling in everyday use, ideal for e.g. manual target preparations.
• QPOX 94 is a low-viscosity and transparent two-component epoxy-based cold mounting resin, ideal for samples with delicate and complex geometries. It is particularly suitable for sensitive and porous surfaces as well as target preparations. With a curing time of about 9 hours Qpox 94 allows transparent and gap-free mounting and preparation on the same day.
• QPREP QPOX 96 Rapid is a fast-curing two-component epoxy resin from QATM. With a curing time of less than 4 hours, it allows sample preparation to be carried out within one day. Due to a maximum curing temperature of less than 120 °C, Qpox 96 Rapid is also suitable for heat-sensitive materials, such as assembled printed circuit boards. Due to its good hardness, low viscosity, good adhesion and transparency, it is ideal for routine target preparation of all types of samples. Designed with a focus on the EHS profile, it is free of DETA and CMR substances and enables safe and efficient materialographic preparation.

Choosing a cold mounting mould of the correct size and suitable material the result of the mounting can be optimized. QPREP offers a variety of reusable and chemically resistant moulds of different sizes and materials for this purpose.

Qmould Grey,  without chamfer

• Two-piece design with practical handles and flexible material for easy removal and demoulding
• Compatible with epoxy resins, ideal for low-shrinkage resins like Qpox; alternative to silicone moulds

Qmould Clear,  without chamfer

• Moulds for ultra-fast, clear UV mounting
• High UV transparency for optimal curing of Qprep UV resins, suitable for UV and acrylic resins
• Handles facilitate sample placement; direct alternative to PP mounting moulds

Qmould White,  without chamfer

• Durable design with resilient material and handles, ideal for high heat
• Cost-effective alternative to Teflon mounting moulds, suitable for polyester and acrylic resins
• Designed for long service life and excellent surface quality

PTFE, beveled edge, round

• Very long service life and shape stability
• High strength, for particularly flat mountings

Silicone rubber, round or rectangular, beveled edge

• Flexibility of the material enables easy demoulding after curing
• Thick-walled mould, therefore, not recommended for light curing
• Without removable base

Polypropylene,  without chamfer

• Semi-transparent, therefore suitable for light curing
• With removable base for easy demoulding after curing

Polyethylene, round,  without chamfer

• Opaque, therefore, not recommended for light curing
• With removable base for easy demoulding after curing

When cold mounting porous specimens it is purposeful to infiltrate them under vacuum, with a low viscosity mounting medium (epoxy resins). The QPREP infiltration device offers a solution for mounting under vacuum.

For transparent cold mounting using methyl methacrylate, these must be cured in a pressure device under positive pressure (2 – 2.5 bar). This increases the boiling point of the mounting material and suppresses the formation of gas bubbles during polymerization. The QPREP Pressure unit is best suited for this purpose.

Product Advantages

• Infiltration of porous materials
• Reinforcement of fragile materials
• Clear/transparent mounting possible with methyl methacrylate

Recommended applications

• Infiltration device for mounting porous samples with epoxy resin (Qpox 90 / 92 / 94)
• Pressure device for mounting with methyl methacrylate (KEM 15, 20, 30, 35, 60 and QPREP SEM 5000)
• Qprep Pressure device for transparent embeddings with KEM 20

Accessories

• Mixing beakers and spatulas
• Mounting utilities
• Dosing spoons
• Steel- and plastic clips

• QPREP UV 50 is a light-curing, acrylic resin-based cold mounting material. It is ideally suited for target preparations and is usually used for routine specimens as well as soft to medium-hard materials with simple geometries. Curing is taken place by using the UV mounting device Qmount, which allows curing of the samples within 60 seconds using UV radiation of a very narrowly tolerated wavelength range (emission maximum at lamda = 365nm).
• Qprep UV 55 is a low-viscosity and light-curing, acrylic-based UV mounting resin. It is ideal for transparent routine mounting of soft to medium-hard materials. Curing is carried out with UV irradiation in the Qmount UV mounting device within 10 minutes. The special composition enables mountings with reduced gaps, which enables preparation of coated and surface-treated materials.

Accessories

• Mixing beakers and spatulas
• Mounting utilities
• Dosing spoons
• Steel- and plastic clips